CITC is an innovation centre within TNO specialising in heterogeneous integration and advanced chip packaging. It develops packaging technologies for RF and mmWave systems, power devices and integrated photonics, supported by facilities for back-end assembly, additive manufacturing, testing and analysis. CITC connects companies, research organisations and education to bridge the gap between academic research and industrial application.
Advanced radar systems; next-generation MRI; wireless connectivity; RF components and packaging.
CITC leads POLARIS theme 1.3, Packaging & Assembly Technologies. It contributes advanced packaging and die-attach expertise to develop reliable, highly integrated RF hardware. Together with Neways, CITC is validating sintering for radar and MRI demonstrators and helping move solutions from laboratory research towards manufacturable industrial applications. Its RF and mmWave work on antenna-in-package, low-loss interconnects and EMI shielding also supports compact, high-performance RF systems.
